Call your local sales representative today to discuss technical questions and sample requests. Link to the comprehensive MacDermid Alpha Preform page to determine the ALPHA® Exactalloy® Preform that meets your need. The main applications include, but not limited to, 1) die-attach and thermal interface materials for semiconductor assembly 2) selective solder volume increase, void reduction, through-hole fill, and component attach for PCB assembly 3) hermetic seals, wire and cable harness interconnect, and thermal fuses for industrial applications. Solder preforms provide a precise volume of solder for many different applications, and are used in a wide variety of electronics packaging and industrial applications. Excellent wetting properties for lid sealing. Superior thermal and electrical conductivity. This product provides: High tensile strength. In 2023, Alpha and Kester combined their preform offerings, integrating more than 150 years of experience in preform manufacturing to provide a variety of technologies, shapes, sizes, and flux types. Our preforms have a high reliability in joining gold-plated surfaces for hermetic sealing such as that required for hermetic microelectronics packaging. Using the right cleaning solution and a clean soft brush the flux and adhesive residue can be cleaned off the package. The package can be air dried using either a static neutralizing gun or with nitrogen.Kester® Preforms are now sold as ALPHA® Exactalloy® Solder Preforms. A properly-profiled reflow source then attaches the solder ball to the package.Īfter being cooled the EZReball™ preform can be pulled off of the package. Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. The package being reballed sits with the ball side up in order to get the best possible ball attachment. The BGA preforms are then aligned to the package making sure of the proper orientation of the preform to the package. They will also have to preform bond pull and other duties as assigned. Assuming the lands of the component are already prepped, water soluble paste flux is spread onto the pads of the component. Candidate will be doing rework on units from QA and from the technicians. Cleaning solution based on the flux usedĮZReball™ Solder Ball Preform Reballing Process FlowĮZReball™ Solder Ball Preform Reballing PrepĪfter confirming the drawing with the user, the preforms are designed, laser machined and populated with the proper-sized balls along with the proper alloy.which can be engineered and fabricated in a few days at BEST Inc. Each unique solder alloy, ball size and grid pattern requires a new preform. The major advantage of this technique is in its convenience as the solder balls are packaged inside of the preform. After being cooled the reballing preform is simply peeled away. Finally, the part is cleaned and inspected. This aligns the land patterns of the device to the preforms' ball locations. After applying flux to the bottom of the part, the balls and part land patterns are aligned and “squared up” with the device. The key to this method is the engineered polyimide and other polymer-based carrier ("preform") which holds the solder balls in place. This BGA reballing process was developed primarily with the speed of attachment and simplicity in mind. EZREball™The solder EZReball™ preform technique (IPC 7711/21 5.7.5.) used for reballing area array devices is one of the methods used at BEST for the attachment of solder balls.
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